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- Inverter modules
Inverter modules
▼MG071
Top surface heat dissipation package contributes to both high heat dissipation and downsizing
▼MG055
Contributes to downsizing in micro EV vehicles, including 2 wheeled EV
▼MG031
The mounting area is reduced by about 60% Three-phase inverter module for motor drive
▼MG032
Reduced number of components contributes to space saving
▼MG048
Contributes to space saving of equipment with compact DIP package,
Three-phase inverter module for motor drive
Top surface heat dissipation package
contributes to both high heat dissipation and downsizing
MG071
[ under development ]
■Motor drive transfer power module
■Contributes to both high heat dissipation and downsizing
■Top surface heat dissipation package
■Non-insulated type
■Cu clip connections
Still under development so contents and specifications are subject to change.
■Contributes to both high heat dissipation and downsizing
■Top surface heat dissipation package
■Non-insulated type
■Cu clip connections
Contributes to both high heat dissipation and downsizing
The top surface heat dissipation package achieves equivalent heat dissipation to 2 parallel 5×6mm packages.The mounting area can be reduced 33.5% compared to 5×6mm packages and 33.3% compared to 7×8mm packages.
This contributes to a reduction in the number of components and a reduction in mounting area.
External Dimensions
Equivalent Circuit
Product Specifications
| Part Name | VDSS [V] | ID [A] | RDS(on)typ. [mΩ] |
|---|---|---|---|
| name TBD | 40 | 250 | 0.9 |
| name TBD | 60 | 200 | 1.5 |
| name TBD | 100 | 140 | 3.5 |
Contributes to downsizing in micro EV vehicles, including 2 wheeled EV
Low-voltage MOSFET power modules for large motor drives
MG055
[ under development ]
■Achieve miniaturization while ensuring a large capacity
■No require additional insulation
■This power module allows a reduction of the number of parallel element connections, which reduces the stress placed on some elements
■No require additional insulation
■This power module allows a reduction of the number of parallel element connections, which reduces the stress placed on some elements
Reduced package size
Package size reduced by approximately 30% compared to conventional products(MG032).
Enhanced lifespan
Epoxy resin sealing provides improved heat shock resistance which contributes to longer lifespan.
High heat dissipation structure
Achieves high efficiency through use of a high heat dissipation structure.
ID-VDSSComparison graph
Connection of control parts is simple
Box connectors allow for one-touch connection.
External Dimensions
Product Specifications
EETMOS3 Chip Mounted(Current models)
| Part Name | VDSS [V] | ID [A] | RDS(on) max [mΩ] | θ（j-c） [°C/W] |
|---|---|---|---|---|
| MG055A | 75 | 420 | 0.63 | 0.23 |
| MG055B | 100 | 320 | 1.21 | 0.23 |
| MG055F | 100 | 420 | 0.64 | 0.18 |
| MG055H | 150 | 320 | 1.60 | 0.18 |
| MG055J | 200 | 190 | 3.30 | 0.18 |
EETMOS5 Chip Mounted(Next generation model)
| Part Name | VDSS [V] | ID [A] | RDS(on) max [mΩ] | θ（j-c） [°C/W] |
|---|---|---|---|---|
| MG055K | 100 | 420 | 0.73 | 0.23 |
| MG055N | 200 | 200 | 3.15 | 0.23 |
The mounting area is reduced by about 60%
Three-phase inverter module for motor drive
MG031
■Internal connection structure with Cu clip
■The exposed lead frame realizes a large current capacity in a compact form
■Junction temperature (Tch) guaranteed up to 175°C Ensured the reliability required for in-vehicle products
■The mounting area is reduced by about 60% compared to the conventional product.（2,200mm2 → 880mm2）
■The exposed lead frame realizes a large current capacity in a compact form
■Junction temperature (Tch) guaranteed up to 175°C Ensured the reliability required for in-vehicle products
■The mounting area is reduced by about 60% compared to the conventional product.（2,200mm2 → 880mm2）
The mounting area is reduced by about 60% compared to the conventional product
Compared to mounting of discrete semiconductors, mounting the MG031 makes it possible to reduce the power component mounting area by approximately 60%.
External Dimensions
Equivalent Circuit
Product Specifications
| Part Name | Circuit | VDSS [V] | ID [A] | Vth [V] | RDS(on) max [mΩ] |
|---|---|---|---|---|---|
| MG031B090004A | 6in1 | 40 | 90 | 2.0 | 3.20 |
| MG031E120004A | 6in1 | 40 | 120 | 3.0 | 3.10 |
| MG031G148004A | 6in1 | 40 | 148 | 3.0 | 2.20 |
| MG031L080006A | 6in1 | 60 | 80 | 3.0 | 5.60 |
| MG031N110006A | 6in1 | 60 | 110 | 3.0 | 3.80 |
| MG031MC148004A | 3in1 | 40 | 148 | 3.0 | 2.20 |
| MG031MD110006A | 3in1 | 60 | 110 | 3.0 | 3.80 |
| MG031S【under development】 | 6in1 | 75 | 80 | 3.0 | 5.00 |
| MG031V【under development】 | 6in1 | 100 | 60 | 3.0 | 8.80 |
| MG031Y【under development】 | 6in1 | 120 | 47 | 3.0 | 13.0 |
| MG031AD【under development】 | 6in1 | 40 | 200 | 3.0 | 1.71 |
| MG031AF【under development】 | 6in1 | 60 | 150 | 3.0 | 2.95 |
| MG031MF【under development】 | 3in1 | 40 | 200 | 3.0 | 1.71 |
| MG031MH【under development】 | 3in1 | 60 | 150 | 3.0 | 2.95 |
Reduced number of components contributes to space saving
Low-voltage MOSFET power modules for large motor drives
MG032
■Achieve miniaturization while ensuring a large capacity
■No require additional insulation
■This power module allows a reduction of the number of parallel element connections, which reduces the stress placed on some elements
■No require additional insulation
■This power module allows a reduction of the number of parallel element connections, which reduces the stress placed on some elements
Achieves reduction of the number of parts and space saving
External Dimensions
Equivalent Circuit
Product Specifications
| Part Name | VDSS [V] | ID [A] | Vth [V] | RDS(on) max [mΩ] |
|---|---|---|---|---|
| MG032A4207R5A | 75 | 420 | 3.0 | 0.98 |
| MG032B420010A | 100 | 420 | 3.0 | 1.37 |
| MG032D【under development】 | 120 | 360 | 3.0 | 1.82 |
| MG032K【under development】 | 150 | 300 | 3.0 | 1.54 |
| MG032L【under development】 | 200 | 220 | 3.0 | 3.17 |
Contributes to space saving of equipment with compact DIP package.
Three-phase inverter module for motor drive
MG048
■Three-phase inverter module for motor drive
■Contributes to space saving of equipment with compact DIP package
■Lead-free, RoHS compliant
■Equipped with shunt resistance 0.5mΩ, thermistor, and snubber circuit
■Insulation is not required because the insulation package is used
■Contributes to space saving of equipment with compact DIP package
■Lead-free, RoHS compliant
■Equipped with shunt resistance 0.5mΩ, thermistor, and snubber circuit
■Insulation is not required because the insulation package is used
External Dimensions
Equivalent Circuit
Product Specifications
| Part Name | VDSS [V] | ID [A] | Vth [V] | RDS(on) max [mΩ] |
|---|---|---|---|---|
| MG048A150004A | 40 | 150 | 3.0 | 2.10 |
| MG048B100006A | 60 | 100 | 3.0 | 2.92 |
