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Samples of low noise SiC power modules are now available

Jul. 25, 2024

Shindengen Electric Manufacturing will begin sample shipments of the MG074 SiC power module for consumer and industrial applications.

Applications such as full-bridge converters and bridgeless PFC in the consumer and industrial equipment markets require high-efficiency, low-loss power devices from an energy-saving perspective. In order to reduce switching losses in such power devices, conventional Si devices are being replaced by SiC devices that can operate at high speeds. However, surge voltages generated during high-speed operation cause noise and ringing, and measures to address this issue have become a challenge.
We have developed the MG074 SiC power module to solve this problem. This product uses a newly developed package to maximize the performance of the on-board SiC MOSFETs. The internal structure is designed with a symmetrical layout and equal wiring lengths to minimize the difference in surge voltage generated in the current path. In addition, by changing the layout of terminals and patterns inside the module, stray inductance has been reduced by 66% compared to the case where two discrete products※1 are used. This contributes to lower noise in equipment.
Furthermore, this product reduces thermal interference by distributing semiconductor elements to achieve higher performance and reliability of the equipment.

※1 Comparison with "TO-247 4pin"


■ Features

1. Low-noise performance
Our proprietary package technology reduces stray inductance and suppresses noise.

①Stray inductance has been reduced
Stray inductance has been reduced by 66% compared to the case where two discrete products※1 are used,contributing to suppression of surge voltage.
 ※1 Comparison with "TO-247 4pin"

   

②Symmetrical layout
The internal structure is designed with a symmetrical layout and equal wiring lengths to minimize the difference in surge voltage generated in the current path.

   

2.  this product reduces thermal interference 
Distributed placement of semiconductor elements, which are heat sources, suppresses temperature rise due to heat interference.



■ Typical Applications

■ Equivalent Circuit

■External Dimensions

・Bridgeless PFC circuit for consumer equipment
・Full bridge converter for industrial equipment

■Specifications

MG074D  
Symbol Value Condition
ID 95A - -
RON 13mΩ Typ. ID=58.0A / VGS=18V
V(BR)DSS 750V Min. -
VTH 2.8V Min. ID=30.8mA / VDS=10V
MG074E  
Symbol Value Condition
ID 51A - -
RON 26mΩ Typ. ID=29.0A / VGS=18V
V(BR)DSS 750V Min. -
VTH 2.8V Min. ID=15.4mA / VDS=10V
MG074F  
Symbol Value Condition
ID 31A - -
RON 45mΩ Typ. ID=17.0A / VGS=18V
V(BR)DSS 750V Min. -
VTH 2.8V Min. ID=8.89mA / VDS=10V


■ Factory location

Akita Shindengen, Co., Ltd. etc.

■Availability

Scheduled for Winter 2025


■ Contact information

Please note that the information contained in releases is current as of the date of press announcement, but may be subject to change without prior notice.

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