OOur module integrates FETs more efficiently than discrete implementation and contributes to downsize of invertor.

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Specification

Product	VDSS	ID	Thermal Resistance (j-c)	RDS(ON Typ)	Weight
MG055F	100V	420A	0.25℃/W	0.64mΩ	0.18kg
MG055N	200V	220A	0.31℃/W	3.15mΩ	0.18kg

Features

✓Achieve Downsizing
　By integrating bare FET chip into one single module, Shindengen achieves the same inverter performances while downsizing.

✓Heat Dissipation
　Our module is carriable of large current because heat could be dissipated not only directly under the chip but also from the clip terminal.