Segment Overview

One of the biggest strengths of this segment is its extensive lineup of power semiconductors used in high-voltage and high-current controls. These devices are increasingly important as power usage increases, reflecting electrification in the automobile market and the growing use of robotics in the industrial machinery market. Diodes, one of our mainstay products, are used in power supply for automobile components, industrial machinery and consumer electronics. MOSFETs, a type of switching device, are used in automobile components and consumer electronics, as well as in motorcycle and four-wheel vehicle ECUs in the Car Electronics segment. We also supply power modules for industrial machinery and automobiles, power ICs (integrated circuits) for lighting and automobiles, and other high-performance products.

R&D

In diodes, we expanded our new product lineup of bridge diodes, developing new products such as super-high-efficiency bridge diodes. Furthermore, we also continued the development of new diode structures that enable larger wafer sizes while reducing costs. We also advanced the development of new high-performance TRIAC products.

In MOSFET products, we have expanded a new product lineup expansion of fifth generation 60V to 200V products with a new low-noise and low-Ron trench structure, and also began development of a new sixth generation 40V product with a new structure. We also advanced development of a new series of diodes and MOSFET products using SiC, a new material.

In power modules, we developed MOS modules for DC/DC converters used in electrified vehicles as well as various diode modules for inverters used in motors. In addition, in discreet devices, we advanced development of new modules with new structures equipped with SiC-MOSFETs.

In IC products, we developed a new IC for voltage control of motorcycles, and are also advancing the development of an 800V high-voltage IC process, which is a new structure.

Capital Investment

Segment capital investment went mainly toward expanding production capacity and upgrades at Akita Shindengen Co., Ltd., Higashine Shindengen Co., Ltd. and Lumphun Shindengen Co., Ltd.

Progress in the Second Year of the 16th Medium Term Business Plan

Opportunities and Risks in the Electronic Device Business

• Opportunities

  • Medium- to long-term demand growth for power semiconductors for industrial machinery and automobiles with the shift to EVs
  • Growing demand for energy saving and efficiency improvements to accommodate increasing data traffic volumes and processing capacity while meeting global calls for reducing CO₂ emissions

• Risks

  • Soaring prices of materials, fuel, and electricity against a backdrop of international conflicts, etc.
  • Economic deceleration in China, damage to global supply chains and related BCP due to U.S.-China decoupling

Progress of the Electronic Device Business Strategy

• 1. Earnings structure construction

  • Reduce product costs at the development stage:
    Minimize costs by such means as using low-cost components and advancing development, including smaller chip size through low-VF and low-Ron design.
  • Reduce product costs at the production stage:
    Increase wafer and lead frame sizes, utilize OEM production, automate and rationalize visual inspection processes, and utilize robotics in manufacturing processes to improve productivity and minimize costs.
  • Reduce product costs through management:
    Promote digital transformation (DX) in production management and process management.

• 2. Building a foundation for expansion of growth businesses

  • Quickly release low-loss, high-current, high-voltage products:
    Reinforce the development of low on-resistance (low-Ron), low-noise MOSFETs, low-VF diodes, and 1,200–1,600 V diodes and MOSFETs, and expand the lineup of products across all voltages, from low to medium, high, and super high.
  • Develop unique elemental technologies and utilize them in product development:
    Expand the lineup of general-use and semi-custom power modules using our circuit technologies and system mounting technologies.
  • Develop products using next-generation devices:
    Advance SiC-SBD(Schottky Barrier Diode) and SiC-MOSFET development, as well as product development using proprietary module technologies.

• 3. Focusing resources on product groups that can reduce greenhouse gas emissions

  • Commercialize low-loss, compact and other products that contribute to electrification:
    Develop eco-friendly products that are both low-loss and compact.
  • Reduce energy used by production facilities and factories:
    Advance upgrades to high-efficiency utility equipment and promote initiatives to reduce energy consumed by air conditioners at overseas factories.